rf mems switch 2smes-01 91 rf mems switch 2smes-01 miniature, 10 ghz band (typical) spdt (transfer contacts) rf mems switch ? superior high-frequency characteristics at 10 ghz typical/8 ghz rated (50 ) ? isolation of 30 db ? insertion loss of 1 db ? ultra-miniature 5.2 x 3.0 x 1.8 mm (l x w x h). ? contact reliability 100 million operations (0.5 ma at 0.5 vdc resistive load) ? rated power consumption of 10 w ? rohs compliant ordering information standard models with surface-mounting terminals note: 1. this rf mems switch was developed on the assumption of cold sw itching. do not exceed ratings by hot switching (greater than 0.5 ma at 0.5 vdc resistive load). 2. this rf mems switch is easily damaged by static electricity. when handling the rf me ms switch, take countermeasures against sta tic electricity. contact omron for handling guidelines. specifications contact ratings terminal arrangement note: the ratings are for a v.s.w.r of 1.2 max. at the load. actuator ratings application examples ? automatic test equipment ? rf measurement instrument ? rf component classification structure packaging package quantity model single-side stable plasti c sealed jedec tray 200 2smes-01 ic pack 50 2smes-01ct load resistive load rated load 0.5 ma at 0.5 vdc rated carry current 100 ma at 10 vdc rf: 30 dbm maximum switching voltage 0.5 vdc maximum switching current 0.5 madc maximum switching capacity 0.25 mw +v2 gnd +v1 rf_1 rf_com rf_2 rated voltage (vdc) rated current (ma) must operate voltage (v) must release voltage (v) absolute maximum voltage (v) rated power consumption ( w) dc 34 5% --- 90% max. of rated voltage 10% min. of rated voltage 40 10
92 rf mems switch 2smes-01 high frequency characteristics note: 1. the impedance of the measurement system is 50 . 2. the above values are initial values. 3. these values are for a v.s.w.r. of 1.2 max. at the load. characteristics note: 1. the above values are initial values. 2. the contact resistance was measured with 10 ma at 1 vdc with a voltage drop method. item 2ghz 8ghz 10ghz 12ghz isolation --- 30 db --- insertion loss --- 1db 1db (typ.) 3db return loss --- 10 db --- maximum peak power 36 dbm --- --- maximum carry power 30 dbm --- --- item single-side stable model 2smes-01 contact resistance 1500 m max. operating time 100 s max. release time 100 s max. insulation resistance v-gnd 100 m (at 40 vdc) others 100 m (at 100 vdc) vibration resistance destruction 10 hz to 500 hz 10 g malfunction 10 hz to 500 hz 10 g shock resistance destruction 100 g malfunction 100 g life expectancy mechanical 100,000,000 operations min. electrical 100,000,000 operations min. esd 100 v (human body model) ambient temperature operating: ? 20 c to 85 c (with no icing or condensation) ambient humidity operating: 5% to 85% weight approx. 0.1 g
rf mems switch 2smes-01 93 engineering data (for reference) high frequency characteristics insertion loss return loss isolation note: 1. ambient temperature condition: 23 c 2. these high-frequency characteristics are measur ed with rf probe (without a mounting board). 3. the high-frequency characteristics depend on the mounting board. be sure to check operat ion including durability in actual equi pment before use. frequency (ghz) average value (initial) (db) ? 3.0 03691215 ? 2.5 ? 2.0 ? 1.5 ? 1.0 ? 0.5 0.0 frequency (ghz) average value (initial) (db) ? 50 03691215 ? 40 ? 30 ? 20 ? 10 0 frequency (ghz) average value (initial) (db) ? 80 ? 60 ? 70 03691215 ? 50 ? 40 ? 30 ? 20 ? 10 0
94 rf mems switch 2smes-01 electrical endurance (c ontact resistance shift) electrical endurance (pick up voltage/release voltage) ambient temperature vs. pickup voltage/release voltage operating cycles (x 10 6 operations) contact resistance shift (m ) 0 10203040 5060708090100 1000 800 600 400 200 0 ? 200 ? 400 ? 600 ? 800 ? 1000 0.5 ma at 0.5 mvdc, hot switch n = 125 samples (250 contacts) operating cycles (million operations) voltage (v) 0 10203040 5060708090100 35 5 10 15 20 25 30 0 n = 125 samples (250 contacts) operate voltage (ave): must operate voltage (30.6 v = 90%) must release voltage (3.4 v = 10%) release voltage (ave): ambient temperature ( c) pickup/release voltage (v) ? 30 ? 20 ? 10 0 10 20 30 40 50 60 70 80 90 100 34 22 20 18 16 24 26 28 30 32 n = 8 samples pickup voltage release voltage
rf mems switch 2smes-01 95 recommended soldering method ? the thickness of the solder paste is to be applied between 150 and 200 m and the land pattern should be based on omron's recom- mended pcb pattern. ? to maintain the correct soldering joint shown in the following dia- gram, we recommend applying solder with the soldering conditions shown on the left. ? check the soldering in the actual mounting conditions before use. ? when washing the product after soldering the rf mems switch to a print circuit board, use a wate r-based solvent or alcohol-based solvent and keep the solvent temperature to less than 40 c. ? do not put the rf mems switch in a cold cleaning bath immedi- ately after soldering. example of drive circuit for rf mems switch note: 1. operate the driving voltage with the high-si de switch (vcont_1 & vcont_2, not ground). 2. it is necessary to discharge the charge that accumulates in the elec trostatic actuator to turn off the rf mems switch because t his product is a mems switch of an electrostatic drive type. install the electrical discharge circui t in the drive circuit of the rf mems s witch with a resistance of 1 m or less. without an electrical discha rge circuit, the rf mems switch might no t turn off, and the contacts could stick. for reference only high frequency characteristics - me thod and substrate for measurement note: substrate: t = 1.6 mm rogers 4350b (dielectric constant at 10 ghz: 3.48) time (s) preheating soldering t 1 t 2 t4 t3 t2 t1 temperature ( c) measuring position/item preheating (t1 to t2, t 1 ) soldering (t3, t 2 ) peak value (t4) terminal 150 c to 180 c 120 s max. 230 c min. 30 s max. 250 c max. upper surface of case --- --- 255 c max. 2smes-01 input 1 driver ic vcont_2 vcont_1 r r +vcc input 2 rf_1 rf_com rf_2 gate driver agilent n5230 vector network analyzer 2smes-01
96 rf mems switch 2smes-01 dimensions note: all units are in millimeters unless otherwise indicated. terminal arrangement evaluation board model: 2smes-01-evba 5.2 0.1 3 0.1 1.85 0.15 1 pin mark 0.5 0.6 no. 1 no. 5 no. 7 no. 11 0.45 0.45 0.45 0.7 0.7 0.7 1.4 0.7 0.6 1.6 0.6 2.3 1 1.35 3.6 2.65 0.45 0.6 4.9 3.7 2.55 1.45 0.4 1.5 0.4 0.4 2.2 no.5 no.1 no.11 no.7 1.1 0.5 1.7 no. 1 2 3 4 5 6 7 8 9 10 11 12 pin arrangement gnd gnd rf_com gnd gnd rf_2 gnd vcont_2 gnd vcont_1 gnd rf_1 mounting pad dimensions 12-terminal land grid array (lga) (top view) 2smes-01 +v2 gnd +v1 rf_1 rf_com rf_2 25 3.5 3.5 11.5 20 2.54 2.54 12.5 12.5 3.5 48 13 6 3.5 3.5 25 3.5 12.5 23 67 20 device mounting area pattern for rf correction (open) pattern for rf correction (thru)
rf mems switch 2smes-01 97 ground plane connections safety precautions precautions for correct use ? turn off power when doing the exchange and the wiring work of the rf mems switch. ? do not touch the terminal of the rf mems switch when energized. rf mems switch handling ? use the rf mems switch as soon as possible after opening the moisture-proof package (within one week). if the rf mems switch is left for a long time after opening the moisture-proof package, the appearance may suffer and seal failure may occur after the solder mounting process. to store the rf mems switch after opening the moisture-proof package, place it into the original package and seal the package with adhesive tape. ? when washing the product after soldering the rf mems switch to a print circuit board, use a wate r-based solvent or alcohol-based solvent and keep the solvent temperature to less than 40 c. do not put the rf mems switch in a cold cleaning bath immediately after soldering. ? do not use an ultrasonic wash. ? this rf mems switch is easily dam aged by static electricity. when handling the rf mems switch, take countermeasure against static electricity (100 v or less). c ontact omron for additional guide- lines. ? when handling the rf mems switch, do not drop. ? do not apply force resulting in the product to transform and change in quality. environmental conditions for usage, storage, and transport ? avoid direct sunlight when using, storing, or transporting the rf mems switch and maintain normal temperature, humidity, and pressure conditions. ? avoid caustic gases when using, storing, or transporting the rf mems switch. coating ? do not coat the rf mems switch when it is mounted to the print circuit board. do not wash the print circuit board after the rf mems switch is mounted using det ergent containing silicone. oth- erwise, the detergent may remain on the surface of the rf mems switch. long-term, continuous on contacts ? using the rf mems switch in a circuit where the rf mems switch will be on continuously for l ong periods (more than 24 hours) (rather than switching) can lead to unstable contacts. if a single- side stable model must be used in this kind of circuit, we recom- mend adding fail-safe circuits in case the contact fails. claw securing force during automatic mounting ? during automatic insertion of rf mems switches, be sure to set the securing force of each claw to the following so that the rf mems switch's characteristics will be maintained. #11 #1 #7 #5 #1 #5 #7 #11 in case of coplanar wave g uide in case of microstrip line s u rface rf gro u nd plane connect all rf gro u nd pads to the s u rface rf gro u nd plane directly. connect each rf gro u nd pad to the internal rf gro u nd plane thro u gh the v ia placed to the rf gro u nd pad. *rf gro u nd pad is designated as v ia to internal rf gro u nd plane v ia to internal rf gro u nd plane direction c: 2.0 n max.
rf mems switch 2smes-01 omron on-line global - http://www.omron.com usa - http://www.components.omron.com cat. no. x301-e-1b printed in usa omron electronic components llc 55 e. commerce drive, suite b schaumburg, il 60173 847-882-2288 09/11 specificat ions subject to change without notice all sales are subject to omron electronic components llc standard terms and conditions of sale, which can be found at http://www.components.omron.com/compon ents/web/webfiles.ns f/sales_terms.html all dimensions shown are in millimeters. to convert millimeters into inches, multiply by 0.0393 7. to convert grams into ounces, multiply by 0.03527.
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